Semiconductor Technology

A fast ramp to high-yield, volume chip production demands innovation - from chip design to device test. Chip manufacturers are challenged to produce and test next-generation devices for computers and mobile electronics with shrinking geometries and expanding performance. To meet these challenges, Vistrian is transforming test with advanced wafer probe solutions-helping chipmakers meet their technical roadmaps for performance and scale, improve yield and reduce the overall cost of test.

The world's leading DRAM, Flash, logic and system-on-chip (SoC) manufacturers depend on Vistrian for advanced 200-mm and 300-mm wafer probe test solutions that make wafer test a strategic advantage in achieving their product roadmaps.

As integrated circuits shrink and so do manufacturing process windows, the number of production parameters to monitor and test grows in volume and complexity. With the evolution of manufacturing workflow and process, Vistrian solutions were used for capturing parametric test data not only precision and reliability, but also fast recovery between electrical tests.

The Vistrian solution supported touchdown tests more integrated circuits simultaneously on a wafer.

Fewer, more productive touchdowns reduce time required for wafer test. Faster completion increases throughput. Extends the value of legacy tester equipment.