Networking & Communication Devices

A fast ramp to high-yield, volume chip production demands innovation - from chip design to device test. Chip manufacturers are challenged to produce and test next-generation devices for computers and mobile electronics with shrinking geometries and expanding performance. To meet these challenges, Vistrian solutions was instrumental in transforming test with advanced wafer probe solutions-helping chipmakers meet their technical roadmaps for performance and scale, improve yield and reduce the overall cost of test.

The world's leading DRAM, Flash, logic and system-on-chip (SoC) manufacturers depend on Vistrian solutions for advanced 200-mm and 300-mm wafer probe solutions that make wafer test a strategic advantage in achieving their product roadmaps.